China-U.S. Scholars Program (CUSP)

The China-U.S. Scholars Program (CUSP) is an exchange fellowship program for Chinese and American scholars and students in the arts, humanities and social sciences to teach, study or conduct research abroad in China, Hong Kong SAR or the US in 2021-2022. The program will award 48 grants to selected faculty and students. The distribution of grants is anticipated to be roughly equal among China and Hong Kong SAR students and scholars traveling to the US, and US students and scholars traveling to China and Hong Kong SAR.  The program is funded by Carnegie Corporation of New York*, Ford Foundation, Harvard-Yenching Institute, Henry Luce Foundation and Rockefeller Brothers Fund.

The application for the China-U.S. Scholars Program (CUSP) will open on March 1, 2021 and close on April 15, 2021. Programs can range from five to ten months and must take place between August 2021 and May 2022.

Read the Announcement from the Funders

For more information, please review our Eligibility policies, learn How to Apply and find out the Benefits for participants.

Please email CUSP@iie.org to receive a notification once the application is open.

*Carnegie Corporation of New York’s grant is pending the Board of Trustees’ approval at its early March meeting.